IISc Pushes for Post-Silicon Chip Innovation

A team of 30 scientists from the Indian Institute of Science (IISc) has submitted a detailed proposal to the government to pioneer next-generation chip technologies using two-dimensional (2D) materials. The proposal, currently under review, outlines plans to develop angstrom-scale semiconductors that could significantly surpass the capabilities of existing silicon-based chips.

This initiative could position India at the forefront of global semiconductor innovation, where most nations still depend on traditional silicon-based manufacturing technologies. According to officials familiar with the submission, the proposal was initially sent to the Office of the Principal Scientific Adviser (PSA) in April 2022 and revised again in October 2024.

2D Materials: The Next Frontier in Semiconductor Innovation

The proposal aims to harness ultra-thin 2D materials, including graphene and transition metal dichalcogenides (TMDs), to develop chips at scales far smaller than current nanometer-level technologies. These new materials offer the potential to break through the miniaturization limits of silicon-based semiconductors, enabling the development of the “angstrom-scale” chip.

The smallest chips in commercial production today are at the 3-nanometer node, manufactured by companies like Samsung and MediaTek. In contrast, IISc’s plan envisions chips that are nearly ten times smaller, offering higher performance, lower power consumption, and new use cases across sectors.

A Strategic Opportunity Amid Global Investments

While countries such as South Korea, Japan, and EU nations have collectively invested billions into research on 2D semiconductors, India has yet to initiate large-scale R&D in this area. The IISc-led team is seeking a comparatively modest funding of ₹500 crore over five years to build the technology base. The proposal includes a roadmap to achieve self-sustainability after the initial support.

Also read: Chhattisgarh Gets First Semiconductor Plant

According to government sources, the Ministry of Electronics and Information Technology (MeitY) is positively considering the project. Consultations are ongoing between MeitY, the PSA’s office, DRDO, Department of Space, and NITI Aayog. Notably, NITI Aayog has already backed the initiative, emphasizing its long-term strategic relevance.

India’s current semiconductor ambitions include major investments, such as Tata Electronics’ ₹91,000 crore partnership with Taiwan’s PSMC to set up a manufacturing unit under the India Semiconductor Mission. However, the IISc proposal focuses on developing India’s core technological IP rather than assembly.

As global leaders prepare for a post-silicon future, Indian researchers warn that time is running out. Without timely investment, India risks falling behind in a race that could define the next era of electronics innovation.

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