The Maharashtra government has allocated 100 acres in Navi Mumbai to RRP Electronics for setting up a semiconductor fabrication facility, marking a major step forward in India’s chip manufacturing ambitions. The fab will relocate capacity from Sherman, Texas, and is expected to produce 1.25 lakh wafers per month, helping reduce India’s reliance on imported components.
Maharashtra cements position in India’s chip roadmap
The land allocation is part of the state’s broader commitment to becoming a high-tech manufacturing hub. Chief Minister Devendra Fadnavis handed over a formal letter of comfort to RRP Electronics, signalling full government support for infrastructure, policy, and skill development.
The facility is expected to create significant employment opportunities and enhance domestic semiconductor supply chains. The state already hosts RRP’s outsourced semiconductor assembly and test (OSAT) facility, further reinforcing its role in the national chip ecosystem.
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Strategic partnerships and global collaboration
The project is backed by former cricketer Sachin Tendulkar and follows a recent partnership between RRP and Taiwan-based HorngCom Technology. That collaboration is aimed at scaling OSAT capabilities in India and comes after a successful technical assessment of RRP’s Mahape facility in Navi Mumbai.
This new fab is expected to complement India’s semiconductor mission by strengthening end-to-end capabilities — from fabrication to testing — within a single geography.
Accelerating India’s chip ecosystem
With global supply chains still facing semiconductor bottlenecks, the new plant positions Maharashtra as a critical node in both domestic and global chip production. The state’s push to integrate policy facilitation, land readiness, and foreign partnerships offers a replicable model for semiconductor investment across other Indian regions.
The project also aligns with India’s strategic goal of building a resilient electronics manufacturing base and attracting foreign players to co-develop capabilities locally.
